Channel thickness dependency of high-k gate dielectric based double-gate CMOS inverter

Authors

  • Beemanpally Vandana Department of ECE, K. G. Reddy College of Engineering & Technology, Hyderabad, Telangana, India.
  • Pachimatla Samrat Department of ECE, Ashoka Institute of Engineering & Technology, Hyderabad, Telangana, India.
  • Shikhar Gupta Department of Electronics and Communication Engineering, NIT Kurukshetra, Haryana, India.
  • Shubham Tayal Department of ECE, Ashoka Institute of Engineering & Technology, Hyderabad, Telangana, India.
  • Vadula Keerthi Department of ECE, Ashoka Institute of Engineering & Technology, Hyderabad, Telangana, India.
Abstract:

This work investigates the channel thickness dependency of high-k gate dielectric-based complementary metal-oxide-semiconductor (CMOS) inverter circuit built using a conventional double-gate metal gate oxide semiconductor field-effect transistor (DG-MOSFET). It is espied that the use of high-k dielectric as a gate oxide in n/p DG-MOSFET based CMOS inverter results in a high noise margin as well as gain. It is also found that delay performance of the inverter circuit also gets degraded slightly by using high-k gate dielectric materials. Further, it is observed that the scaling down of channel thickness (TSi) improves the noise margin (NM), and gain (A) at the cost of propagation delay (Pd). Moreover, it is also observed that the changes in noise margin (ΔNM = NM(K=40) – NM(K=3.9)), propagation delay (ΔPd = Pd (K=40) – Pd (K=3.9)), and gain (ΔA = A(K=40) – A(K=3.9)) gets hinder at lower TSi. Therefore, it is apposite to look at lower channel thickness (~6 nm) while designing high-k gate dielectric-based DG-MOSFET for CMOS inverter cell.

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Journal title

volume 11  issue 3

pages  215- 221

publication date 2020-07-01

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